| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 05 | WO/2026/020282 | HOUSING ASSEMBLY, MANUFACTURING METHOD FOR HOUSING ASSEMBLY, AND DEVICE HAVING HOUSING ASSEMBLY | CN2024/106824 | H05K 5/02 | HONOR DEVICE CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020580 | METHOD FOR FORMING STUB-FREE VIA HOLE, AND PCB | CN2024/120547 | H05K 3/42 | VICTORY GIANT TECHNOLOGY (HUIZHOU) CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020749 | SERVER CABINET POWER SUPPLY DEVICE AND CABINET POWER SUPPLY SYSTEM | CN2024/144255 | H05K 7/14 | CHINA MOBILE GROUP DESIGN INSTITUTE CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020766 | EMBEDDED-COMPONENT SUBSTRATE, POWER SUPPLY APPARATUS, AND ELECTRONIC DEVICE | CN2025/071963 | H05K 1/18 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020900 | CIRCUIT BOARD, CONNECTOR, AND CONNECTOR ASSEMBLY | CN2025/089782 | H05K 1/02 | JONHON OPTRONIC TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020980 | CASE AND ELECTRICAL APPARATUS | CN2025/097870 | H05K 7/20 | CONTEMPORARY AMPEREX FUTURE ENERGY RESEARCH INSTITUTE (SHANGHAI) LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/020998 | VAPOR CHAMBER AND ELECTRONIC DEVICE | CN2025/099063 | H05K 7/20 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021008 | RING-TYPE SECONDARY-SIDE LIQUID-COOLING LOOP SYSTEM, LIQUID-COOLED MICRO-MODULE, AND FLUID REPLACEMENT METHOD | CN2025/099402 | H05K 7/20 | SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021093 | TEMPERATURE CONTROL STRATEGY DETERMINATION METHOD AND SYSTEM, COMPUTING DEVICE AND STORAGE MEDIUM | CN2025/103061 | H05K 7/20 | CLOUD INTELLIGENCE ASSETS HOLDING (SINGAPORE) PRIVATE LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021170 | FLEXIBLE CIRCUIT PLATE, CIRCUIT BOARD ASSEMBLY, TEMPERATURE DETECTION APPARATUS, AND ELECTRONIC DEVICE | CN2025/105092 | H05K 1/02 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021320 | HOUSING APPARATUS AND ELECTRONIC DEVICE | CN2025/108970 | H05K 5/02 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021440 | REAR COVER, STRUCTURAL MEMBER AND ELECTRONIC DEVICE | CN2025/109881 | H05K 5/03 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021774 | ELECTRONIC POWER MODULE WITH POTTING COMPOUND COVERED BY COVER | EP2025/067831 | H05K 1/02 | SIEMENS AKTIENGESELLSCHAFT | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021901 | OPTICAL DETECTION UNIT HAVING A SPECIFICALLY FASTENED CIRCUIT BOARD, AND METHOD | EP2025/069940 | H05K 5/00 | VALEO DETECTION SYSTEMS GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/021948 | COOLING DEVICE | EP2025/070208 | H05K 7/20 | VALEO SYSTEMES THERMIQUES | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022835 | AN INTEGRATED CONTROLLER ASSEMBLY FOR A VEHICLE | IN2024/052121 | H05K 7/20 | TVS MOTOR COMPANY LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/022909 | MOUNTING DEVICE AND MOUNTING METHOD | JP2024/026202 | H05K 13/04 | FUJI CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023158 | INDOOR INSTALLATION TYPE ELECTRICAL DEVICE | JP2025/012746 | H05K 7/20 | HITACHI INDUSTRIAL PRODUCTS, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023256 | ELECTROMAGNETIC WAVE SHIELD | JP2025/020538 | H05K 9/00 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023331 | CASE | JP2025/023200 | H05K 5/03 | JATCO LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023395 | FPC, CONNECTOR MODULE, AND ELECTRONIC DEVICE | JP2025/024414 | H05K 1/02 | KYOCERA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023410 | METHOD FOR MANUFACTURING DEVICE | JP2025/024663 | H05K 1/02 | NOK CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023411 | WIRING BOARD AND RESIN FILM | JP2025/024666 | H05K 1/02 | NOK CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023412 | WIRING BOARD | JP2025/024668 | H05K 1/02 | NOK CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023703 | WIRING BOARD AND SEMICONDUCTOR DEVICE | JP2025/026563 | H05K 3/46 | KYOCERA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023725 | COOLING APPARATUS EQUIPPED WITH TELEMATICS MODULE FOR VEHICLE | KR2024/010851 | H05K 7/20 | LG ELECTRONICS INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023726 | TELEMATICS MODULE AND CONTROL METHOD THEREFOR | KR2024/010856 | H05K 7/20 | LG ELECTRONICS INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023831 | CERAMIC CIRCUIT SUBSTRATE COMPRISING UNIDIRECTIONAL POROUS METAL LAYER, AND POWER MODULE EQUIPPED WITH SAME | KR2025/007272 | H05K 1/02 | INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023832 | CERAMIC CIRCUIT SUBSTRATE COMPRISING UNIDIRECTIONAL POROUS METAL THERMAL INTERFACE MATERIAL LAYER, AND POWER MODULE EQUIPPED WITH SAME | KR2025/007274 | H05K 1/03 | INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023835 | CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE | KR2025/007306 | H05K 3/46 | LG INNOTEK CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023836 | CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE | KR2025/007315 | H05K 1/18 | LG INNOTEK CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023872 | CERAMIC CIRCUIT SUBSTRATE COMPRISING UNIDIRECTIONAL POROUS METAL SPACER, AND POWER MODULE EQUIPPED WITH SAME | KR2025/008454 | H05K 1/02 | INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023873 | CERAMIC CIRCUIT SUBSTRATE COMPRISING UNIDIRECTIONAL POROUS METAL BASE PLATE, AND POWER MODULE EQUIPPED WITH SAME | KR2025/008455 | H05K 1/03 | INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/023973 | ELECTRONIC DEVICE COMPRISING HEAT TRANSFER MEMBER | KR2025/010297 | H05K 7/20 | SAMSUNG ELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024051 | HOUSING COMPONENT OF ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR | KR2025/010799 | H05K 5/00 | SAMSUNG ELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2026 | 05 | WO/2026/024119 | ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER | KR2025/011011 | H05K 7/20 | SAMSUNG ELECTRONICS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای |